Per- and polyfluoroalkyl substances or PFAS have faced increased scrutiny because they are environmentally persistent and certain PFAS have also been found to be bioaccumulative and toxic. In recent years, PFAS chemistries have been grouped as a class based on chemical structure rather than physical and chemical properties or environmental and human health considerations. This class definition has brought into scope many fluorocarbons found in semiconductor manufacturing, including the fluoropolymers used to ensure safe handling and distribution of chemicals and gases, as well as perfluorocarbon (PFC) and hydrocarbon (HFC) gases used in plasma etch processes. This paper will present a historical perspective of the semiconductor industry’s efforts to reduce F-GHG consumption and emissions. It will conclude with an overview of the work of the Semiconductor PFAS Consortium and their plasma etch and deposition working group.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.