Analysing each layer's thermal resistance along the thermal transfer channel is a crucial initial step towards enhancing packaging and thermal reliability. Popular techniques for doing non-destructive analyses of material assembly structures are structural functions. We suggest a unique assessment technique to calibrate the structural functions in this work. The unique technique has practical physical importance in addition to the functions of the structure and may be applied as feedback to create a closed loop system. Additionally, structural functions with various configuration settings examine a 3D simulation temperature drop curve and calibrate it using an evaluation approach.
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