Mr. Tie Feng Profile

Tie Feng

at Capital Normal Univ

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 8 September 2011 Paper

The effect of depth on the quantitative estimation of defect size using pulsed thermography

Tie Feng, Cunlin Zhang, Lichun Feng

Proceedings Volume 8193, 81933B (2011) https://doi.org/10.1117/12.900752

KEYWORDS: Thermography, 3D modeling, Thermal modeling, Finite element methods, Metals, Aluminum, Heat flux, Nondestructive evaluation, Infrared radiation, 3D metrology

Read Abstract +

Although active thermography has traditionally been regarded as a qualitative NDT method, its potential for quantitative measurement of thermophysical properties including wall thickness, defect size and depth, thermal diffusivity has been the subject of numerous investigations. An investigation into the effect of depth on the quantitative estimation of defect size in metalic specimen has been undertaken using pulsed thermography. A 3D model based on finite element method was used to simulate the heat conduction in a flat metal plate containing articial defects. The plate is made of steel with known thermal properties. The defects of different depth are flat bottom holes simulating areas damaged by corrosion. The goal of the1 research was to find if there is a possibility to combine pulsed thermography and numberical modeling to determine the effect of depth on the quantitative estimation of defect size. The temperature distribution on the metal surface can provide proper threshold value to extract edge of defect in thermography. A series of specimen with circular defect of varying diameter and depth were tested. To solve this problem, we analysis the FEM simulation results, investigate the relationship between measured value and true value, and introduce a correction factor related to depth. Using this correction factor, its measured value in the thermography is quite close to the design size of defect in the specimen.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years