Packaging materials usable for DUV-LEDs are limited as most organic materials are affected by DUV radiation. Packages used are TO-packages or 3D-structured ceramic housings with quartz lid. Due to DUV-LEDs radiating up to 50% of their light to the sides a significant share is lost.
This paper describes a hermetic SMD-compatible packaging approach that integrates reflectors into a quartz window to maximize the light extraction. Side emitted and otherwise wasted light is redirected towards the surface. It avoids costly 3D-structured ceramics and improves the overall thermal performance. Design choices of the reflector structures allow to tailor the radiation patterns of the LEDs.
The large variety of the technologies and physical, chemical or biochemical effects united in micro systems requires a new generation of quality assurance. An appropriate quality management should check all conceivable influences on the product and perform a complete tolerance synthesis based on its function and with regard to manufacturing and cost optimization. In the following, a new approach to function-oriented tolerance analysis and synthesis is presented. The Institutes for Engineering Design and Micro Technology in Braunschweig, Germany, have developed a computer program, which assists Design Engineers in tolerance analysis and synthesis in micro technology. This contribution presents the theoretical background of this software. For a better understanding two short MEMS examples are shown.
In order to efficiently design complex micromechanical systems there is a growing demand for layout synthesis tools that directly derive the layout description from the device description. This paper outlines a systematic method of using genetic algorithms to synthesize the lithographic mask layout of micromachined silicon devices. The procedure has been implemented in the computer program OMEA, which calculates an optimal or semi-optimal layout description from the three-dimensional device description of the component. Currently, this method is applied to chemical deep etching of silicon. To model the structuring process the program makes use of a coupled etch simulator. Synthesis results show that the design engineer is enabled to take full advantage of the possible design space of the underlying process technology. The tool is an integrated part of the CAD environment BICEPS. In order to demonstrate the capability of the concept the design process of a spring actuator is described in detail.
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