This study conducted extensive reliability and stability tests on a fully packaged 1x12 silicon photonic MEMS switch. The switch underwent optical and electrical packaging, including electrostatic discharge (ESD) protection. Durability tests, such as endurance and hysteresis tests, were performed to assess the switch's stability with billions of cycles. Optomechanical stability was evaluated through long-term measurements of optical output powers in single-cast and multi-cast scenarios. High-speed data transmission tests and eye diagram analysis were conducted to evaluate signal integrity. This research provides valuable insights into the reliability of fully packaged silicon photonic MEMS devices and contributes to the advancement and wider adoption of this technology for commercial applications.

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Jae Hyeon Kim, Dong Uk Kim, Mingi Lim, Young J. Park, Dong Ju Choi, Myung Seok Hong, Kyoungsik Yu, and Sangyoon Han, "Reliability assessment of a fully packaged 1x12 silicon photonic MEMS multicast switch," Proc. SPIE PC12899, MOEMS and Miniaturized Systems XXIII, PC1289901 (Presented at SPIE OPTO: January 29, 2024; Published: 13 March 2024); https://doi.org/10.1117/12.3001263.04cfad6d-2425-ee11-a99a-b38e0bc17c27.