Characterization Data And Cross Matching Of A High Performance Step-And-Repeat Aligner

Herbert E. Mayer; Ernst W. Loebach

doi:10.1117/12.933570

13 September 1982 Characterization Data And Cross Matching Of A High Performance Step-And-Repeat Aligner

Herbert E. Mayer, Ernst W. Loebach

Author Affiliations +

Proceedings Volume 0334, Optical Microlithography I: Technology for the Mid-1980s; (1982) https://doi.org/10.1117/12.933570
Event: 1982 Microlithography Conferences, 1982, Santa Clara, United States

Abstract

A wafer step-and-repeat alignment system, presented in 1980, is briefly reviewed 1, followed by a discussion emphasizing the aspects of cross-matching to wafer global alignment instruments. Issues relevant for cross-matching (wafer pre-alignment and exposure field fine-alignment) are covered in detail. Basic performance data for resolution, alignment accuracy, and throughput are given and first cross-matching results are reported.

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Herbert E. Mayer and Ernst W. Loebach "Characterization Data And Cross Matching Of A High Performance Step-And-Repeat Aligner", Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); https://doi.org/10.1117/12.933570

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