Studies on nanosecond 532nm and 355nm and ultrafast 515nm and 532nm laser cutting super-hard materials

Jie Zhang; Sha Tao; Brian Wang; Jay Zhao

doi:10.1117/12.2253753

20 February 2017 Studies on nanosecond 532nm and 355nm and ultrafast 515nm and 532nm laser cutting super-hard materials

Jie Zhang, Sha Tao, Brian Wang, Jay Zhao

Proceedings Volume 10091, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII; 1009110 (2017) https://doi.org/10.1117/12.2253753
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

In this paper, micro-processing of three kinds of super-hard materials of poly-crystal diamond (PCD)/tungsten-carbide (WC), CVD-diamond and cubic boron nitride (CNB) has been systematically studied using nanosecond laser (532nm and 355nm), and ultrafast laser (532nm and 515nm). Our purpose is to investigate a full laser micro-cutting solution to achieve a ready-to-use cutting tool insert (CTI). The results show a clean cut with little burns and recasting at edge. The cutting speed of ~2-10mm/min depending on thickness was obtained. The laser ablation process was also studied by varying laser parameters (wavelength, pulse width, pulse energy, repetition rate) and tool path to improve cutting speed. Also, studies on material removal efficiency (MRE) of PCD/WC with 355nm-ns and 515nm-fs laser as a function of laser fluence show that 355nm-ns laser is able to achieve higher MRE for PCD and WC. Thus, ultrafast laser is not necessarily used for superhard material cutting. Instead, post-polishing with ultrafast laser can be used to clean cutting surface and improve smoothness.

Conference Presentation

Citation Download Citation

Jie Zhang, Sha Tao, Brian Wang, and Jay Zhao "Studies on nanosecond 532nm and 355nm and ultrafast 515nm and 532nm laser cutting super-hard materials", Proc. SPIE 10091, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII, 1009110 (20 February 2017); https://doi.org/10.1117/12.2253753

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