Experimental characterization of NTD resist shrinkage

Bernd Küchler; Thomas Mülders; Hironobu Taoka; Weimin Gao; Ulrich Klostermann; Sou Kamimura; Grozdan Grozev; Masahiro Yoshidome; Michihiro Shirakawa; Waikin Li

doi:10.1117/12.2256568

24 March 2017 Experimental characterization of NTD resist shrinkage

Bernd Küchler, Thomas Mülders, Hironobu Taoka, Weimin Gao, Ulrich Klostermann, Sou Kamimura, Grozdan Grozev, Masahiro Yoshidome, Michihiro Shirakawa, Waikin Li

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Proceedings Volume 10147, Optical Microlithography XXX; 101470F (2017) https://doi.org/10.1117/12.2256568
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

Simulation of negative tone development (NTD) resist has become a challenge for physical resist modeling. Traditionally, resist modeling was mainly limited to reaction-diffusion models for post exposure bake (PEB) and standard development rate models for simulating the pattern formation during the final development step. With some minor extensions, this simulation approach sufficiently predicted resist CDs and resist profile shapes that were in agreement with experimental data.³ For the latest NTD resists, this situation has changed. In contrast to positive tone development (PTD) resists, resist shrinkage is strongly impacting resist profile shapes. Furthermore, NTD resists induce strong proximity effects that require consideration of additional chemical resist properties in modeling and model calibration. In this paper we experimentally characterize and model the main properties of NTD photo-resists.

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Bernd Küchler, Thomas Mülders, Hironobu Taoka, Weimin Gao, Ulrich Klostermann, Sou Kamimura, Grozdan Grozev, Masahiro Yoshidome, Michihiro Shirakawa, and Waikin Li "Experimental characterization of NTD resist shrinkage", Proc. SPIE 10147, Optical Microlithography XXX, 101470F (24 March 2017); https://doi.org/10.1117/12.2256568

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