Dense two-dimensional integration of optoelectronics and electronics for interconnections

David A. B. Miller

doi:10.1117/12.300615

27 January 1998 Dense two-dimensional integration of optoelectronics and electronics for interconnections

David A. B. Miller

Author Affiliations +

Proceedings Volume 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review; 1029206 (1998) https://doi.org/10.1117/12.300615
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

Optics has many features, beyond those already exploited in long-distance fiber communications, that make it interesting for interconnections at short distance, including dense optical interconnections directly to silicon integrated circuit chips. Hybrid technologies, such as solder-bump bonding, have recently been successfully used to attach two-dimensional arrays of optical detectors, emitters, and modulators to silicon electronics. Quantum well modulator or self-electro-optic-effect devices (SEEDs), and vertical-cavity surface-emitting lasers (VCSELs) have received particularly strong attention as candidates for the necessary arrayed output devices. This article summarizes the research and prospects in these fields.

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David A. B. Miller "Dense two-dimensional integration of optoelectronics and electronics for interconnections", Proc. SPIE 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review, 1029206 (27 January 1998); https://doi.org/10.1117/12.300615

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