Advanced chip package of a fiber-coupled superconducting single-photon detector for a closed-cycle cryostat

Ch. Möller; K. Neckermann; M. Kermann; T. Ortlepp

doi:10.1117/12.2287785

29 January 2018 Advanced chip package of a fiber-coupled superconducting single-photon detector for a closed-cycle cryostat

Ch. Möller, K. Neckermann, M. Kermann, T. Ortlepp

Author Affiliations +

Proceedings Volume 10561, Next-Generation Optical Communication: Components, Sub-Systems, and Systems VII; 105610F (2018) https://doi.org/10.1117/12.2287785
Event: SPIE OPTO, 2018, San Francisco, California, United States

Abstract

Superconducting single photon detectors are promising candidates for cutting-edge applications like space-to-ground communication and quantum-key-distribution. The challenge is to transfer the assembly technology from university research to industrial processes. Especially the positioning of the optical fiber with respect to the active area of the superconducting detector are open questions. We demonstrate the operation of a superconducting nanowire single photon detector (SNSPD) in a closed cycle cryostat. The thermal coupling between superconducting detector chip and closed-cycle cryostat is investigated. The possibility to mount the optical fiber in an RIE-ICP-etched hole in a silicon carrier wafer is demonstrated. Different illumination wavelength and intensities are used to validate the SNSPD assembly in the closed cycle cryostat. Further, an advanced package of the silicon carrier wafer and the SNSPD-chip is introduced. In this package, the SNSPD-chip is mounted via flip-chip technology on the silicon carrier wafer. The striven flip-chip position accuracy of ± 1 μm ensures the accurate coupling between optical fiber and active area of the SNSPD.

Conference Presentation

Citation Download Citation

Ch. Möller, K. Neckermann, M. Kermann, and T. Ortlepp "Advanced chip package of a fiber-coupled superconducting single-photon detector for a closed-cycle cryostat", Proc. SPIE 10561, Next-Generation Optical Communication: Components, Sub-Systems, and Systems VII, 105610F (29 January 2018); https://doi.org/10.1117/12.2287785

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available