Open Access Paper
20 November 2017 GAIA payload module mechanical development
S. Touzeau, E. Sein, C. Lebranchu
Author Affiliations +
Proceedings Volume 10564, International Conference on Space Optics — ICSO 2012; 105640W (2017) https://doi.org/10.1117/12.2309184
Event: International Conference on Space Optics 2012, 2012, Ajaccio, Corsica, France
Abstract
Gaia is the European Space Agency's cornerstone mission for global space astrometry. Its goal is to make the largest, most precise three-dimensional map of our Galaxy by surveying an unprecedented number of stars.

This paper gives an overview of the mechanical system engineering and verification of the payload module. This development includes several technical challenges. First of all, the very high stability performance as required for the mission is a key driver for the design, which incurs a high degree of stability. This is achieved through the extensive use of Silicon Carbide (Boostec® SiC) for both structures and mirrors, a high mechanical and thermal decoupling between payload and service modules, and the use of high-performance engineering tools. Compliance of payload mass and volume with launcher capability is another key challenge, as well as the development and manufacturing of the 3.2-meter diameter toroidal primary structure. The spacecraft mechanical verification follows an innovative approach, with direct testing on the flight model, without any dedicated structural model.
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S. Touzeau, E. Sein, and C. Lebranchu "GAIA payload module mechanical development", Proc. SPIE 10564, International Conference on Space Optics — ICSO 2012, 105640W (20 November 2017); https://doi.org/10.1117/12.2309184
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