Ultrahigh Resolution Positive Working Photoresist For Half-Micron Photolithography

Yoshiyuki Satoh; Hidekatsu Kohara; Nobuo Tokutake; Kohichi Takahashi; Toshimasa Nakayama

doi:10.1117/12.953047

30 January 1989 Ultrahigh Resolution Positive Working Photoresist For Half-Micron Photolithography

Yoshiyuki Satoh, Hidekatsu Kohara, Nobuo Tokutake, Kohichi Takahashi, Toshimasa Nakayama

Proceedings Volume 1086, Advances in Resist Technology and Processing VI; (1989) https://doi.org/10.1117/12.953047
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

Along with the increase in the integrations of IC's, the process dimensions of photolithography is proceeding to more and more fine patterns. In the fabrication of 16 Mega bit DRAM which is the next generation device, the photolithography will be required to have a technology close to half micron geometry work. The role to be played by photoresists in such geometry work is extremely large and important. Under such circumstance, we have developed ultrahigh resolution positive working photoresist, TSMR-V3 which can cope with a half micron photolithography.

Citation Download Citation

Yoshiyuki Satoh, Hidekatsu Kohara, Nobuo Tokutake, Kohichi Takahashi, and Toshimasa Nakayama "Ultrahigh Resolution Positive Working Photoresist For Half-Micron Photolithography", Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); https://doi.org/10.1117/12.953047

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