Characterization of STEM alignments and their automation

Ashley Tilson; Silvia Aerts

doi:10.1117/12.2514837

26 March 2019 Characterization of STEM alignments and their automation

Ashley Tilson, Silvia Aerts

Proceedings Volume 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII; 109592V (2019) https://doi.org/10.1117/12.2514837
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

Abstract

Each of six scanning transmission electron microscope (STEM) system alignments were characterized with a sensitivity test to better understand the impact of the alignment on microscope automation for acquisition and metrology. The upper and lower limits of the alignment sensitivity combined with the accuracy of the automated system alignments are used to determine the process capability index (C_pk). The primary limiting factor for the alignment sensitivity was passing the metrology dynamic precision criteria of <0.3nm. Strong alignment offset showed impact on the autofunction robustness, but was marginal in comparison to the metrology sensitivity. All six of the STEM system alignments resulted in C_pk values greater than 1.3, supporting a three sigma quality process. Based on these results, criteria can be defined for alignment offset limits that will trigger automated preventative maintenance (APM) re-alignments and ensure that automated STEM metrology will meet the accuracy and precision requirements for adequate process control.

Citation Download Citation

Ashley Tilson and Silvia Aerts "Characterization of STEM alignments and their automation", Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109592V (26 March 2019); https://doi.org/10.1117/12.2514837

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KEYWORDS

Metrology

Optical alignment

Diffraction

Scanning transmission electron microscopy

Microscopes

Monochromatic aberrations

Visualization

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