Improved wafer alignment model algorithm for better on-product overlay

Ik-Hyun Jeong; Hyun-Sok Kim; Yeong-Oh Kong; Ji-Hyun Song; Jae-Wuk Ju; Young-Sik Kim; Cees Lambregts; Miao Yu; Rizvi Rahman; Leendertjan Karssemeijer; Elliott McNamara; Paul Böcker; Jong-Cheol Choi; Nang-Lyeom Oh; Kang-San Lee; Jin-Seo Lee

doi:10.1117/12.2516259

20 March 2019 Improved wafer alignment model algorithm for better on-product overlay

Ik-Hyun Jeong, Hyun-Sok Kim, Yeong-Oh Kong, Ji-Hyun Song, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Miao Yu, Rizvi Rahman, Leendertjan Karssemeijer, Elliott McNamara, Paul Böcker, Jong-Cheol Choi, Nang-Lyeom Oh, Kang-San Lee, Jin-Seo Lee

Author Affiliations +

Proceedings Volume 10961, Optical Microlithography XXXII; 109610A (2019) https://doi.org/10.1117/12.2516259
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

Abstract

To support the manufacturing of DRAM semiconductors for next and future nodes, there is a constant need to reduce the overlay fingerprints. In this paper we evaluate algorithms which are capable of decoupling wafer deformation from mark deformation and extrapolation effects. The algorithms enable lithography tools to use only the wafer deformation component in the alignment feedforward correction. Therefore improving the (wafer to wafer) overlay. First results will be shared showing improvement of wafer to wafer variation in high-volume manufacturing environment.

Conference Presentation

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Ik-Hyun Jeong, Hyun-Sok Kim, Yeong-Oh Kong, Ji-Hyun Song, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Miao Yu, Rizvi Rahman, Leendertjan Karssemeijer, Elliott McNamara, Paul Böcker, Jong-Cheol Choi, Nang-Lyeom Oh, Kang-San Lee, and Jin-Seo Lee "Improved wafer alignment model algorithm for better on-product overlay", Proc. SPIE 10961, Optical Microlithography XXXII, 109610A (20 March 2019); https://doi.org/10.1117/12.2516259

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