Bayesian estimation of defect patterns in composite materials using through-thickness dielectric measurements

Mushuang Liu; Yan Wan; Vamsee Vadlamudi; Frank L. Lewis; Kenneth Reifsnider; H. Felix Wu

doi:10.1117/12.2514647

1 April 2019 Bayesian estimation of defect patterns in composite materials using through-thickness dielectric measurements

Mushuang Liu, Yan Wan, Vamsee Vadlamudi, Frank L. Lewis, Kenneth Reifsnider, H. Felix Wu

Author Affiliations +

Proceedings Volume 10971, Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII; 109710Z (2019) https://doi.org/10.1117/12.2514647
Event: SPIE Smart Structures + Nondestructive Evaluation, 2019, Denver, Colorado, United States

Abstract

Composite materials play important roles in multifunctional applications, and thus, the diagnosis of damage patterns in composite materials becomes crucial to avoid critical events" such as structural or functional failures. The impact of an individual damage in composite materials has been extensively studied, however, the interaction of defects/cracks, which leads to critical fracture paths, has not been understood well. In this paper, we develop a Bayesian estimation based statistical analysis technique that estimates the damage pattern of a composite material, in particular, the relative positions of defects in the material, by measuring its through-thickness dielectric properties. We first explain the fundamental dielectric principle that leads to the detection of defect patterns. A capacitance model is then built to measure the material permittivity, and the relationship between the dielectric permittivity and relative positions are found using COMSOL Multiphysics. The interaction effects between defects observed in the simulation are interpreted using the fundamental dielectric principle. A Bayesian estimation based statistical analysis model is then developed to estimate the relative positions of defects in composite materials from the measured global dielectric properties.

Conference Presentation

Citation Download Citation

Mushuang Liu, Yan Wan, Vamsee Vadlamudi, Frank L. Lewis, Kenneth Reifsnider, and H. Felix Wu "Bayesian estimation of defect patterns in composite materials using through-thickness dielectric measurements", Proc. SPIE 10971, Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII, 109710Z (1 April 2019); https://doi.org/10.1117/12.2514647

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