Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integration

Kazuhiko Kurata; Richard Pitwon

doi:10.1117/12.2546626

28 February 2020 Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integration

Kazuhiko Kurata, Richard Pitwon

Author Affiliations +

Proceedings Volume 11286, Optical Interconnects XX; 112860R (2020) https://doi.org/10.1117/12.2546626
Event: SPIE OPTO, 2020, San Francisco, California, United States

Abstract

We report on the design and performance of a compact, low power, micro-transceiver chip suitable for high volume, long life deployment in high temperature (>100°C) environments. The I/O Core micro-transceiver comprises a 5mm x 5mm silicon photonics chip with a multimode interface and incorporates 4 transmit and 4 receiver channels operating at 25 Gb/s in the O-band. We will demonstrate how the I/O Core micro-transceiver may be deployed in a wide variety of packages and applications spaces including data centers, HPCs, 5G, AI and automotive systems.

Conference Presentation

Citation Download Citation

Kazuhiko Kurata and Richard Pitwon "Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integration", Proc. SPIE 11286, Optical Interconnects XX, 112860R (28 February 2020); https://doi.org/10.1117/12.2546626

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