Stochastic processes in self-assembly:  limits and strategies for mitigation (Conference Presentation)

J. Alexander Liddle; Michael Zwolak; Jacob Majikes

doi:10.1117/12.2552246

24 March 2020 Stochastic processes in self-assembly: limits and strategies for mitigation (Conference Presentation)

J. Alexander Liddle, Michael Zwolak, Jacob Majikes

Proceedings Volume 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020; 1132410 (2020) https://doi.org/10.1117/12.2552246
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

Fabrication via self-assembly has been explored for its potential to overcome the challenges of feature size/density and stochastic variability facing conventional lithographic approaches. While methods such as diblock-copolymer directed self-assembly have trouble meeting defectivity and edge-placement specifications, techniques such as atomic layer deposition and self-aligned sidewall-spacer methods are standard. Using DNA origami as an example, I will discuss the conditions for simple systems to form low-defectivity structures, and the potential for self-assembling systems to create complex, hierarchical nanostructures, and their inherent limitation. I will comment on choosing the right applications for the initial introduction of bottom-up fabrication methods.

Conference Presentation

Citation Download Citation

J. Alexander Liddle, Michael Zwolak, and Jacob Majikes "Stochastic processes in self-assembly: limits and strategies for mitigation (Conference Presentation)", Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 1132410 (24 March 2020); https://doi.org/10.1117/12.2552246

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