Photonic Integrated Circuits (PICs) are expected to disrupt the industry similar to what Integrated Circuits did in the electronics industry by shrinking size, weight and cost while increasing performance at the same time. Many optical functions can be integrated in a PIC ranging from a simple beam combiner to a fully integrated optical frequency comb. LIGENTEC's technology addresses today’s challenges of Integrated photonics with low propagation loss, ease of optical coupling and short development cycles. We will present our novel SiN platform for PICs, it’s main functional building blocks and their performance, show effective ways for optical I/Os and a pathway to heterogeneous integration of active elements. Finally, we will discuss application examples in LiDAR, Quantum Computing and RF-optical links in Metrology.
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