Ultra-broadband, high-efficiency, and wafer-scale fiber-to-chip coupling using free-form micro-optical reflectors

Shaoliang Yu; Luigi Ranno; Qingyang Du; Samuel Serna; Colin McDonough; Nicholas Fahrenkopf; Tian Gu; Juejun Hu

doi:10.1117/12.2605054

5 March 2022 Ultra-broadband, high-efficiency, and wafer-scale fiber-to-chip coupling using free-form micro-optical reflectors

Shaoliang Yu, Luigi Ranno, Qingyang Du, Samuel Serna, Colin McDonough, Nicholas Fahrenkopf, Tian Gu, Juejun Hu

Author Affiliations +

Proceedings Volume 12006, Silicon Photonics XVII; 1200604 (2022) https://doi.org/10.1117/12.2605054
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

Optical coupling between fibers and on-chip waveguides is a critical step in photonic testing and packaging. We demonstrated broadband surface-normal fiber-to-chip optical coupling based on free-form micro-optical reflector arrays integrated with foundry-processed SiN photonics. The couplers yield a low fiber-to-waveguide coupling loss of 0.5 dB at 1550 nm wavelength, and an exceptionally broad 1-dB bandwidth encompassing O to L bands (1260 nm to 1640 nm), only limited by the wavelength range of our testing setup. In-plane 1-dB alignment tolerances up to ± 2.4 µm and an out-of-plane 1-dB alignment tolerance up to 20 µm were obtained at 1550 nm. We further show that the Optical Free-Form Couplers for High-density Integrated Photonics (OFFCHIP) platform is universally applicable for chip-to-chip, waveguide to free space, and waveguide to surface-normal device coupling, qualifying it as a universal high-performance optical coupling interface for diverse use scenarios.

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Shaoliang Yu, Luigi Ranno, Qingyang Du, Samuel Serna, Colin McDonough, Nicholas Fahrenkopf, Tian Gu, and Juejun Hu "Ultra-broadband, high-efficiency, and wafer-scale fiber-to-chip coupling using free-form micro-optical reflectors", Proc. SPIE 12006, Silicon Photonics XVII, 1200604 (5 March 2022); https://doi.org/10.1117/12.2605054

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