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Flip-chip VCSELs with backside emission revolutionize 3D sensing systems. Etching lenses directly into the GaAs substrate is the most compact way to integrate optics with the VCSEL. Various lens structures can be implemented enabling collimation as well as the uniform illumination of a defined field of view. Superior to separate optical elements the integrated optics avoids the need for individual alignment of laser die and optics and makes them an irremovable part of the chip, which is beneficial for long-term laser safety. The realization of both contacts on the epitaxy side enables flip-chip assembly without the need for wire bonds. This facilitates thermal management compared to top-emitting VCSELS and reduces system impedance. Individually addressable zones can be easily implemented, contacting is done via fine-pitch copper pillars. Backside emitting VCSELs can be designed for a large emission area thus enabling a very high active area of the array. This is especially useful for operating schemes with low duty-cycle enabling ultra-high pulse power output per chip area. VCSEL chips with integrated flood illumination optics for time-of-flight applications with narrow or broad field of view will be presented. Addressability of multiple zones on a chip can be implemented for enhanced illumination and sensing schemes. The ViBO technology platform allows for a wide variation of VCSEL chip properties and a significant miniaturization of illumination systems.
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Stephan Gronenborn, Xi Gu, Markus Herper, Johanna Kolb, Stefan Schlegel, Alexander Weigl, Holger Moench, Armand Pruijmboom, Roman Koerner, "ViBO-VCSEL with integrated backside optics," Proc. SPIE 12020, Vertical-Cavity Surface-Emitting Lasers XXVI, 1202003 (2 March 2022); https://doi.org/10.1117/12.2607355