A dimensional stability measurement method for the vacuum-encapsulated insulation panel under different temperature environment

Xiaojun Tang; Zijie Sun; Jingzhen Han; Wentao Yu

doi:10.1117/12.2638812

29 April 2022 A dimensional stability measurement method for the vacuum-encapsulated insulation panel under different temperature environment

Xiaojun Tang, Zijie Sun, Jingzhen Han, Wentao Yu

Author Affiliations +

Proceedings Volume 12255, 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022); 1225524 (2022) https://doi.org/10.1117/12.2638812
Event: 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022), 2022, Chongqing, China

Abstract

In view of the limitations of the existing monitoring methods for dimensional stability of the vacuum-encapsulated insulation panel under high and low temperature environment, based on digital image correlation (DIC) measurement technology and high and low temperature environment test technology, this paper proposes a multi-face dimensional stability measurement method under temperature change environment through the research of multi-face synchronous noncontact measurement design and low temperature measurement method for anti-condensation frost. This method aims to achieve accurate monitoring of dimensional stability of the vacuum-encapsulated insulation panel under high and low temperature environment. The non-contact deformation measurement system for multi-faces at high temperature and low temperature was designed, and a high-precision thermal deformation test platform was built. The measurement accuracy verification test was carried out, and the test results showed that the measurement accuracy of the system was better than 2×10^-6/°C in the temperature change environment. The measurement of dimensional stability of the vacuum-encapsulated insulation panel is successfully realized by using the test platform.

Citation Download Citation

Xiaojun Tang, Zijie Sun, Jingzhen Han, and Wentao Yu "A dimensional stability measurement method for the vacuum-encapsulated insulation panel under different temperature environment", Proc. SPIE 12255, 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022), 1225524 (29 April 2022); https://doi.org/10.1117/12.2638812

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