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A Welding/Cutting laser system that uses Wavelength Beam Combining (WBC) technology for semiconductor blue lasers, the specifications for are 445 (nm) regions in wavelength, 400 (W) in output power with a fiber diameter of ≤50 (μm) and 2.0 (mm*mrad) (typical) in beam parameter product has developed. It is also possible to combine multiple of these to increase the power to a multi-kW level. Using this laser light source, we tried a laser annealing experiment on a sputtered amorphous silicon film (50 nm thickness) on inexpensive glass with the line laser (4.0 (mm)×38 (μm)). The result shows a high crystallinity and full width at half maximum (cm-1) < 7 (nm) at the peak position of 517 (cm-1) with Raman microscope, which was high uniformity in the in the 4mm length in long axis direction.
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Mitsuoki Hishida, Naohiko Kobata, Kentaro Miyano, Hiroaki Suzuki, Masaki Nobuoka, Tatsuya Okada, Takashi Noguchi, "Crystallization of a-Si films deposited by RF sputtering using blue direct diode laser," Proc. SPIE 12409, Laser-based Micro- and Nanoprocessing XVII, 1240912 (17 March 2023); https://doi.org/10.1117/12.2651151