Presentation + Paper
28 April 2023 Design for inspection methodology for fast in-line eBeam defect detection
Andrzej J. Strojwas, Tomasz Brozek, Dennis Ciplickas, Indranil De
Author Affiliations +
Abstract
This paper presents a novel methodology called Design-for-Inspection (DFI) that enables sensitive inline pickup for failure mechanisms previously undetectable until product test (wafer sort, final test, HTOL) or field failures. Dummy filler cells are replaced in the physical design flow by DFI-enabled filler cells which are designed to be sensitive to specific failure modes without any area penalty. To achieve very high inspection throughput, we have developed a proprietary vector scanning eBeam Voltage Contrast tool called eProbe 250 which is capable of inspecting up to 5 billion Devices Under Test (DUT) per hour. Due to novel processing of gray levels the system is capable of detecting not only the hard defects such as shorts or opens, but also the soft failures, namely leakages and resistive contacts and vias. We illustrate this methodology by several examples from the most recent FinFET technology nodes.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrzej J. Strojwas, Tomasz Brozek, Dennis Ciplickas, and Indranil De "Design for inspection methodology for fast in-line eBeam defect detection", Proc. SPIE 12495, DTCO and Computational Patterning II, 1249517 (28 April 2023); https://doi.org/10.1117/12.2660862
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KEYWORDS
Semiconducting wafers

Inspection

Design and modelling

Reliability

Defect detection

Failure analysis

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