Providing solutions for replacement of legacy tools with advanced features

H. Hamada; K. Egami; S. Kanai; A. R. Gupta; S. Murakami; K. Nakanishi; K. Matsumura; A. K. Acharya

doi:10.1117/12.2686670

21 November 2023 Providing solutions for replacement of legacy tools with advanced features

H. Hamada, K. Egami, S. Kanai, A. R. Gupta, S. Murakami, K. Nakanishi, K. Matsumura, A. K. Acharya

Proceedings Volume 12751, Photomask Technology 2023; 127510J (2023) https://doi.org/10.1117/12.2686670
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

Since several years, there has been continuous focus on legacy tools for mask making and the critical requirements to address the end of life of equipment which has been workhorse for volume production. Toppan Photomask Company, Ltd. (TPC) has presented several papers on this subject and brought this to attention to many equipment manufacturers and other mask shops who have also shown keen interest to support the manufacturers who are willing to take up this task to provide solutions. HTL Co. Japan Ltd. And V Technology Japan has teamed up to manufacture equipment for the semiconductor mask making legacy tools and one such example is successfully manufacturing the mask repair system with support from TPC. Mask inspection, Registration, FIB repair and others also being addressed, and one attractive feature is to give an opportunity to enhance the performance of these new replacement tools by using AI software for defect classification for the system. We will discus our development process and capabilities served for legacy tool replacement.

Conference Presentation

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

H. Hamada, K. Egami, S. Kanai, A. R. Gupta, S. Murakami, K. Nakanishi, K. Matsumura, and A. K. Acharya "Providing solutions for replacement of legacy tools with advanced features", Proc. SPIE 12751, Photomask Technology 2023, 127510J (21 November 2023); https://doi.org/10.1117/12.2686670

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