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21 December 2023 Multi-wavelength laser array based on REC integrated with silicon-based devices by photonic wire bonding
Yipeng Mei, Yuxin Ma, Jun Lu, Tongtong Yang, Yuechun Shi, Lianyan Li, Xin Wang, Ming Li, Rulei Xiao, Xiangfei Chen
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Proceedings Volume 12966, AOPC 2023: AI in Optics and Photonics ; 129661Y (2023) https://doi.org/10.1117/12.3007834
Event: Applied Optics and Photonics China 2023 (AOPC2023), 2023, Beijing, China
Abstract
A 16-channel optical transmitter chip with a digital transmission capacity up to 1.6 Tb/s has been demonstrated. In this chip, a 16-wavelength III–V DFB laser array (MLA), a silicon Mach-Zehnder interferometer (MZI) modulator array and a 16-channel fiber array are hybrid integrated by photonic wire bonding (PWB) technique. The MLA based on reconstruction-equivalent-chirp (REC) technique proves a good wavelength spacing uniformity of all wavelengths. Each unit laser with 1.2 mm cavity length in the MLA exhibits good single-longitudinal-mode operation with the output power over 18 dBm at an injection current of 300 mA. Spectral measurements show the channels coincide well with the designed 200 GHz spacing, with wavelength deviations within a range of ±0.2 nm. Based on PWB technique, three chips mentioned above are integrated optically on one Wu-Cu substrate as a 16-channel optical transmitter. The largest output power of optical transmitter is 1.5 mW and all channels still keep good single mode outputs after PWB integration. The tested modulation speed of each channel is up to 100 Gb/s, which implies the total transmission capacity of this device is 1.6 Tb/s.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Yipeng Mei, Yuxin Ma, Jun Lu, Tongtong Yang, Yuechun Shi, Lianyan Li, Xin Wang, Ming Li, Rulei Xiao, and Xiangfei Chen "Multi-wavelength laser array based on REC integrated with silicon-based devices by photonic wire bonding", Proc. SPIE 12966, AOPC 2023: AI in Optics and Photonics , 129661Y (21 December 2023); https://doi.org/10.1117/12.3007834
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KEYWORDS
Laser bonding
Silicon photonics
Transmitters
Integrated optics
Optical transmission
Semiconductor lasers
Silicon
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