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This paper will show a very precise and easier concept to align CCD sensor packages out of an extremely stiff and precise machined SiC based composite material called HB-Cesic to assemble numerous sensors on a focal plane with micron precision. The focal plane structure will be from the same ceramic material therefore, the complete focal plane assembly will be manufactured out of a single material having a very low CTE with high thermal conductivity. Such assembly can be scaled from Cubesats like 6U up to very large scaled focal plane assemblies (FPA) like 1 x 1m for ground-based applications to allow super precise alignments and high camera resolution.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Matthias R. Kroedel
"Novel ceramic concept for CCD sensor packages and focal plane assemblies", Proc. SPIE 13103, X-Ray, Optical, and Infrared Detectors for Astronomy XI, 131031O (27 August 2024); https://doi.org/10.1117/12.3016962
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Matthias R. Kroedel, "Novel ceramic concept for CCD sensor packages and focal plane assemblies," Proc. SPIE 13103, X-Ray, Optical, and Infrared Detectors for Astronomy XI, 131031O (27 August 2024); https://doi.org/10.1117/12.3016962