Poster + Paper
27 August 2024 Novel ceramic concept for CCD sensor packages and focal plane assemblies
Author Affiliations +
Conference Poster
Abstract
This paper will show a very precise and easier concept to align CCD sensor packages out of an extremely stiff and precise machined SiC based composite material called HB-Cesic to assemble numerous sensors on a focal plane with micron precision. The focal plane structure will be from the same ceramic material therefore, the complete focal plane assembly will be manufactured out of a single material having a very low CTE with high thermal conductivity. Such assembly can be scaled from Cubesats like 6U up to very large scaled focal plane assemblies (FPA) like 1 x 1m for ground-based applications to allow super precise alignments and high camera resolution.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Matthias R. Kroedel "Novel ceramic concept for CCD sensor packages and focal plane assemblies", Proc. SPIE 13103, X-Ray, Optical, and Infrared Detectors for Astronomy XI, 131031O (27 August 2024); https://doi.org/10.1117/12.3016962
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Sensors

CCD image sensors

Ceramics

Design

Staring arrays

Cameras

Interfaces

RELATED CONTENT

Alignment and integration of the first PLATO camera
Proceedings of SPIE (August 27 2022)
Technology of large focal planes of CCDs
Proceedings of SPIE (January 12 2004)
Long-wavelength scattered-light halos in ASC CCDs
Proceedings of SPIE (July 09 1998)
Detector-Charge-Coupled Device (CCD) Interface Methods
Proceedings of SPIE (February 18 1981)

Back to Top