Paper
3 September 2024 On-chip optical frequency comb-based wireless terahertz interconnect system for data centers
Chenxiang Tong, Yiming Yin, Chengtao Jiang, Qinfen Hao, Mingjun Xia
Author Affiliations +
Proceedings Volume 13227, 2024 AI Photonics Technology Symposium; 1322701 (2024) https://doi.org/10.1117/12.3034969
Event: 2024 AI Photonics Technology Symposium, 2024, Wuhan, China
Abstract
The rapid development of artificial intelligence and big data has increasingly heightened the demands on data center interconnection technologies. Terahertz wireless communication technology, which does not rely on physical cables, offers important interconnection form for data center. Our study introduces a new terahertz wireless interconnect system based on on-chip optical frequency comb for data center. It discusses the impact of waveguide second order dispersion on the generation of on-chip optical frequency combs and terahertz wireless interconnect performance in a data center environment. Simulation results show that using PAM4 encoding, the system based on an on-chip optical frequency comb can achieve a transmission rate of 120Gbps with bit error rate below 0.001 for data center terahertz wireless interconnects. This study lays a basic foundation for the future application of wireless terahertz interconnect in data center.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Chenxiang Tong, Yiming Yin, Chengtao Jiang, Qinfen Hao, and Mingjun Xia "On-chip optical frequency comb-based wireless terahertz interconnect system for data centers", Proc. SPIE 13227, 2024 AI Photonics Technology Symposium, 1322701 (3 September 2024); https://doi.org/10.1117/12.3034969
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KEYWORDS
Data centers

Terahertz radiation

Dispersion

Frequency combs

Data transmission

Telecommunications

Waveguides

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