Paper
1 December 1990 Minimizing defects in infrared coatings on silicon
Jack P. Chambers, Stanley F. Himelinski, K. F. Irvine, Terence M. Donovan, Jean M. Bennett
Author Affiliations +
Abstract
Studies were made of the origins of defects in multilayer coatings used as high reflectors in the infrared, with the aim of reducing the numbers of defects and increasing the laser-damage threshold for the coatings. Clean-room conditions were found to be essential for cleaning and coating low-defect substrates. The levels ofsurface and subsurface defects on the substrate were the most important parameters in determining defects on a completed coating. Although the initial chromium film on the silicon substrate appeared to contribute many defects, it was actually making visible submicron defects that were already on the substrates. When the vacuum coating system was operated under clean conditions, the multilayer coatings added few defects to ones already present. Defect densities were reduced by a factor of 100 during the course of the study, resulting in a significant improvement in the laser-damage threshold of the coatings.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jack P. Chambers, Stanley F. Himelinski, K. F. Irvine, Terence M. Donovan, and Jean M. Bennett "Minimizing defects in infrared coatings on silicon", Proc. SPIE 1323, Optical Thin Films III: New Developments, (1 December 1990); https://doi.org/10.1117/12.22396
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Semiconducting wafers

Surface finishing

Optical coatings

Image processing

Thin film coatings

Particles

RELATED CONTENT

Production of silicon pore optics
Proceedings of SPIE (June 13 2006)
Compressive coatings for strengthened sapphire
Proceedings of SPIE (July 26 1999)
PVD SiC and PVD Si coatings on RB SiC for...
Proceedings of SPIE (June 09 2006)
Processing study of next-generation substrate
Proceedings of SPIE (November 13 2002)
Requirements of measurement equipment for silicon wafers
Proceedings of SPIE (November 04 1996)

Back to Top