Traditional multispectral Color Filter solutions require a costly, complex wafer coatings process on a single glass, in partnership with TASA, Liscotech and TASA co-developed a mechanical architecture, named Multi-Band-in-One (MBIO) which defines multi-trench design, supporting individual off-the-shelf color filters, reducing production costs and accelerating lead times. This MBIO architecture has been proven successfully in Liscotech RSI3000, equipped with R/G/B/PAN/NIR MBIO filters and the AMS CMV12000 sensor, making it ideal for detailed EO. The SWIR1000, featuring Sony’s IMX991 SWIR sensor, excels in shortwave infrared (SWIR) imaging for weather and environmental monitoring. Both models leverage AMD UltraScale FPGA, enabling real-time preprocessing like AG, AWB, and Edge AI on the sensor side. Platforms have undergone rigorous testing, including radiation, vacuum thermal cycling, and vibration, ensuring reliability in extreme space conditions.
|