Paper
10 December 2024 The implementation of overlay compensation between multiple photo layers generated by a single mask
Author Affiliations +
Proceedings Volume 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024); 134230N (2024) https://doi.org/10.1117/12.3052904
Event: 8th International Workshop on Advanced Patterning Solutions (IWAPS 2024), 2024, Jiaxing, Zhejiang, China
Abstract
Researchers occasionally use a single photomask to create a stacked structure with identical patterns. This method is cost-effective but also challenging for precise overlay control, due to the lack of coupled overlay marks between successive layers. In this paper, an innovative approach has been developed to address this problem. By shifting the exposure field with a specific offset, the outer overlay mark of the previous layer and the inner overlay mark of the current layer are aligned to the same coordinate position, allowing for accurate measurement of the overlay error. The raw overlay measurement values are then modeled using polynomials and compensated during subsequent runs. The effectiveness of this method has been demonstrated with experiment wafers, and PFA (Physical Failure Analysis) result further confirmed its feasibility for achieving precise overlay in such applications.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Hao Yang, Di Liang, Yuxing Zhou, Jiahao Xi, Enqiang Tian, Ganlin Song, Mingyi Yao, Jiangliu Shi, and Miao Jiang "The implementation of overlay compensation between multiple photo layers generated by a single mask", Proc. SPIE 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024), 134230N (10 December 2024); https://doi.org/10.1117/12.3052904
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KEYWORDS
Overlay metrology

Semiconducting wafers

Photomasks

Failure analysis

Modeling

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