Paper
12 December 2024 A new method for numerical analysis of piezoelectric smart materials
Zhiqin Zhao, Luchun Zhao
Author Affiliations +
Proceedings Volume 13446, Sixth International Conference on Optoelectronic Science and Materials (ICOSM 2024); 134460K (2024) https://doi.org/10.1117/12.3052852
Event: 6th International Conference on Optoelectronic Science and Materials (ICOSM 2024), 2024, Hefei, China
Abstract
Based on the principle of minimum potential energy combined with the modified Hellinger-Reissner (H-R) variational principle, one kind of noncompatible symplectic isoparametric equation can be established that includes displacement and out-of-plane stress variables. And it can be easily extended to engineering materials containing multi-physics fields or related smart structures. The method shows better numerical performance than similar compatible element by introducing the noncompatible shape function of the displacement variable for discretisation. Since the control equation contains only two types of variables, displacement and out-plane stress, the space occupied by linear equations is less than that of the mixed method. Numerical examples show that the method with generalized displacement and generalized out-of-plane stress variables gives high accuracy and fast convergence of the force and current results obtained in this paper.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Zhiqin Zhao and Luchun Zhao "A new method for numerical analysis of piezoelectric smart materials", Proc. SPIE 13446, Sixth International Conference on Optoelectronic Science and Materials (ICOSM 2024), 134460K (12 December 2024); https://doi.org/10.1117/12.3052852
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KEYWORDS
Matrices

Smart materials

Ferroelectric polymers

Quantum efficiency

Piezoelectric materials

Elasticity

Finite element methods

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