X-ray lithography system development at IBM: overview and status

Juan R. Maldonado

doi:10.1117/12.47339

1 August 1991 X-ray lithography system development at IBM: overview and status

Juan R. Maldonado

Proceedings Volume 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing; (1991) https://doi.org/10.1117/12.47339
Event: Microlithography, 1991, San Jose, CA, United States

Abstract

This paper describes the work conducted at IBM to study the feasibility of x-ray lithography for production of high-density silicon chips. The system approach to x-ray lighography adopted at IBM which considers the interaction of all the components is presented. In particular, the following areas are described in some detail: x-ray sources, masks, resists, exposure tools, prototype devices fabricated with x-ray lighography, and the resolution of x- ray lighography. In addition, the status of the Advanced Lithography Facility which house the compact electron storage ring x-ray source, procured by IBM from Oxford Instruments, is presented.

Citation Download Citation

Juan R. Maldonado "X-ray lithography system development at IBM: overview and status", Proc. SPIE 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing, (1 August 1991); https://doi.org/10.1117/12.47339

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