Paper
1 March 1991 Research on enhancing signal and SNR in laser/IR inspection of solder joints quality
Zhengjun Xiong, Xuezhong Cheng, Xiande Liu
Author Affiliations +
Abstract
The quality of electronic products is directly dependent upon that of solder joints on printed circuit boards (PCB's). The inspection of solder joints quality by use of both Laser and Infrared technology is an advanced technique. However, small signal and low signal-to-noise ratio (S/N) require the system to have a high sensitivity to temperature changes. In order to overcome them, in this paper, two methods to enhance signal and S/N in certain laser beam power and warming time are proposed and experimented. The theoretical analysis and experiment results show that: (1) When laser beam is injected into the solder joints at a certain angle with the normal of their surface, the signal and S/N increase, in general, the increment is 2-3 times. (2) When the solder joints is located at a position with a distance from the focus of thr optics, where the solder joints are just full of the field of view of the optical system, the S/N can be improved. In this case, the requirement on the stability of working is largely loosened.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhengjun Xiong, Xuezhong Cheng, and Xiande Liu "Research on enhancing signal and SNR in laser/IR inspection of solder joints quality", Proc. SPIE 1467, Thermosense XIII, (1 March 1991); https://doi.org/10.1117/12.46453
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KEYWORDS
Inspection

Laser welding

Reflectivity

Signal to noise ratio

Laser applications

Laser energy

Sensors

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