PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
This paper reports the use of a unique reactive ion etching (RIE) in Schottky barrier power diode manufacture. Reverse electrical characteristics of conventional Schottky barrier diodes are compared with those of the devices fabricated by RIE. It is shown that such devices give better reverse electrical characteristics eliminating the inherent edge effects of metal- semiconductor contacts. It is also shown that the device yield has been raised to 60%, which is much better than that of conventional Schottky diodes.
Shu-Lan Zhao,Yuan Jing Li,Jia Feng Yu,Ya-Li Yang,Shu Qin Liu,Ya Fu Fan,Xiu Yin Bao, andZheng Qing Li
"New process for improving reverse characteristics of platinum silicide Schottky barrier power diodes", Proc. SPIE 1519, International Conference on Thin Film Physics and Applications, (1 November 1991); https://doi.org/10.1117/12.47320
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Shu-Lan Zhao, Yuan Jing Li, Jia Feng Yu, Ya-Li Yang, Shu Qin Liu, Ya Fu Fan, Xiu Yin Bao, Zheng Qing Li, "New process for improving reverse characteristics of platinum silicide Schottky barrier power diodes," Proc. SPIE 1519, International Conference on Thin Film Physics and Applications, (1 November 1991); https://doi.org/10.1117/12.47320