Automated visual inspection of SMDs in an industrial environment

Eam-Khwang Teoh; Dinesh P. Mital

doi:10.1117/12.138484

18 January 1993 Automated visual inspection of SMDs in an industrial environment

Eam-Khwang Teoh, Dinesh P. Mital

Proceedings Volume 1713, International Conference on Manufacturing Automation; (1993) https://doi.org/10.1117/12.138484
Event: International Conference on Manufacturing Automation, 1992, Hong Kong, Hong Kong

Abstract

This paper presents the techniques used to inspect for defects on surface mount PCBs. Focusses were made on five different types of defects, namely, missing components, misalignment, wrong orientation of I.C. chips, wrong parts, and poor solder joints. Thus, five separate algorithms had been developed to detect these faults. The technique of windowing was employed to reduce the amount of redundant data to be processed. Preprocessing functions like convolution as well as all image processing tasks are performed on the window regions only, saving tremendously on computation time. Experimental results showed that these algorithms are reliable, fast, and cost-effective.

Citation Download Citation

Eam-Khwang Teoh and Dinesh P. Mital "Automated visual inspection of SMDs in an industrial environment", Proc. SPIE 1713, International Conference on Manufacturing Automation, (18 January 1993); https://doi.org/10.1117/12.138484

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