Paper
1 July 1993 Progress and status of guided-wave optical interconnection technology
Author Affiliations +
Proceedings Volume 1849, Optoelectronic Interconnects; (1993) https://doi.org/10.1117/12.147108
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
Optical interconnects at the cabinet-to-cabinet, board-to-board, and multichip module-to- multichip module levels will enable future avionics systems requirements to be met by eliminating undesirable compromises associated with electrical interconnects. Fiber optics is the well established medium of choice for cabinet-to-cabinet applications, while planar polymeric interconnects are required at the backplane level. Significant advances have been made in demonstrating practical polymer interconnects compatible with existing board fabrication principles, however both waveguide loss and interfaces to optoelectronic components require further improvement before the technology is broadly applicable.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Julian P. G. Bristow, Charles T. Sullivan, Sayan D. Mukherjee, Yue Liu, and Anis Husain "Progress and status of guided-wave optical interconnection technology", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); https://doi.org/10.1117/12.147108
Lens.org Logo
CITATIONS
Cited by 11 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Optical interconnects

Information operations

Waveguides

Interfaces

Optoelectronic devices

Fiber optics

Polymers

RELATED CONTENT

Assembly and performance of silicone polymer waveguides
Proceedings of SPIE (March 15 2016)
Photofabrication Of Multimode Network Components
Proceedings of SPIE (January 14 1987)
Polymeric optical MEMS
Proceedings of SPIE (March 10 1999)
Optical interconnects for board level applications
Proceedings of SPIE (February 10 2009)

Back to Top