Inexpensive packaging techniques of fiber pigtailed laser diodes

Pentti Karioja; Kari Tukkiniemi; Veli Heikkinen; Ilkka P.A. Kaisto

doi:10.1117/12.147600

24 June 1993 Inexpensive packaging techniques of fiber pigtailed laser diodes

Pentti Karioja, Kari Tukkiniemi, Veli Heikkinen, Ilkka P.A. Kaisto

Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147600
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States

Abstract

Commercial single heterojunction GaAs laser diode chips have been fiber pigtailed with a 100/140 micrometers fiber. These lasers, producing 5 ... 10 W peak pulse power, are used in time-of-flight distance measurement instruments. The laser chips were purchased mounted on a coaxial TO-5 base. Two different types of packaging constructions were tested: a sleeve construction and a butt construction. In the sleeve construction the fiber was aligned with the laser chip using a loose sleeve and a fiber ferrule. In the butt construction the fiber ferrule was butt coupled to the laser submount. The fiber ferrule was actively aligned with the laser and fixed with an adhesive or with an adhesive and laser welding. Silicone gel potting was tested to improve the module stability in outdoor applications. The pigtailed laser modules and commercial laser modules were temperature cycled and results were compared. The measurements show that the properties of the adhesive are crucial to the temperature stability of the module. The tests show that optical output variation of the module was 6 dB in the temperature range of -20 ... 55 degree(s)C when the peak power was 3.7 W at room temperature. The stability of poor adhesive joints can be improved utilizing laser welding. However, the drawback is the high investment cost of equipment required. The results show that simple and inexpensive fiber pigtailed modules can be made using properly selected adhesives.

Citation Download Citation

Pentti Karioja, Kari Tukkiniemi, Veli Heikkinen, and Ilkka P.A. Kaisto "Inexpensive packaging techniques of fiber pigtailed laser diodes", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); https://doi.org/10.1117/12.147600

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available