Paper
15 February 1994 Benchmarking of temperature measurement and control capability of commercially available rapid thermal processor (RTP) systems
Ankineedu Velaga, Jim Brown, Donald W. Lindholm
Author Affiliations +
Abstract
Rapid thermal processors (RTP) have been used in the semiconductor industry mainly for silicidation and implant anneal with limited success. SEMATECH is in the process of establishing a joint development project with supplier community to improve the situation. To understand the capability of the tools, a benchmark experiment was conducted using oxidation at 1100 degree(s)C (target 90 angstroms), and Boron implant (5 E 15 20 KeV) anneal at 900 degree(s)C for 20 sec. Oxide thickness and sheet resistance were measured as an indirect capability of temperature measurement and control of the tools. The experiments in RTP were performed with `pyrometer closed-loop control' and `open-loop power control' where applicable. Both process data and temperature measurement data are analyzed and presented. The analysis of oxide thickness and sheet resistance (implant anneal) data shows that the closed-loop pyrometer control of temperature is not a viable technique to use in the manufacturing. The power control technique with the pyrometer in the open-loop (read only) demonstrates better process control and can be used until more viable technique is found. The reproducibility of open-loop power control technique for longer periods needs to be evaluated. This study demonstrates the urgent need to develop a real-time temperature measurement and control technique for the RTP tools to be accepted in the manufacturing world.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ankineedu Velaga, Jim Brown, and Donald W. Lindholm "Benchmarking of temperature measurement and control capability of commercially available rapid thermal processor (RTP) systems", Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); https://doi.org/10.1117/12.167336
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KEYWORDS
Pyrometry

Semiconducting wafers

Temperature metrology

Control systems

Oxidation

Oxides

Resistance

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