Optimizing TAB bonding to flat panel displays using design of experiments

Ralph L. Reynolds

doi:10.1117/12.241017

30 May 1996 Optimizing TAB bonding to flat panel displays using design of experiments

Ralph L. Reynolds

Proceedings Volume 2734, Cockpit Displays III; (1996) https://doi.org/10.1117/12.241017
Event: Aerospace/Defense Sensing and Controls, 1996, Orlando, FL, United States

Abstract

Image Quest Technologies has successfully developed a fine pitch interconnect bonding process for AMLCD flat panel displays. A design of experiments (DOE) technique was used to develop and optimize the process. A DOE experimental matrix was used to bond test units in tape automated bonding (TAB) to glass substrates. The bonding adhesive material was anisotropic conductive film (ACF). The DOE interconnect bonding process described in this paper exceeds quality requirements, and has proven to be robust in production.

Citation Download Citation

Ralph L. Reynolds "Optimizing TAB bonding to flat panel displays using design of experiments", Proc. SPIE 2734, Cockpit Displays III, (30 May 1996); https://doi.org/10.1117/12.241017

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