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Picosecond laser pulses were used for microstructuring metals, ceramics and diamond. Using 40 ps laser pulses line patterns with a minimum line width in the range of 7 micrometer were formed in diamond without destroying the crystallinity. In Si3N4-ceramics holes were drilled with diameters smaller than 6 micrometer. Ultrathin copper and gold films of 1 micrometer thickness were removed from fused silica and silicon (100) without influencing the substrates. The ablation process was investigated by high-speed photography and pump-&- probe-measurements with a time resolution of 40 picoseconds. The measurements allow a detailed characterization of the melting, vaporization and solidification processes. Shock waves in the ambient atmosphere were detected and the energy in the shock wave was determined.
Juergen Jandeleit,P. Russbueldt,G. Urbasch,D. Hoffmann,Ernst-Wolfgang Kreutz, andHans-Georg Treusch
"Picosecond imaging of laser-induced ablation processes and production of microstructures by picosecond laser pulses", Proc. SPIE 3092, XI International Symposium on Gas Flow and Chemical Lasers and High-Power Laser Conference, (4 April 1997); https://doi.org/10.1117/12.270113
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Juergen Jandeleit, P. Russbueldt, G. Urbasch, D. Hoffmann, Ernst-Wolfgang Kreutz, Hans-Georg Treusch, "Picosecond imaging of laser-induced ablation processes and production of microstructures by picosecond laser pulses," Proc. SPIE 3092, XI International Symposium on Gas Flow and Chemical Lasers and High-Power Laser Conference, (4 April 1997); https://doi.org/10.1117/12.270113