Paper
20 July 1998 Integrated packaging concept for an intelligent transducer
Matthias Heschel, J. F. Kuhmann, Siebe Bouwstra, M. Amskov
Author Affiliations +
Abstract
In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other with an intermediate chip in between. The bonding of the transducer and the intermediate chip is done by flip chip solder bump bonding. The bonding between the above two-layer stack and the circuit chip is done by conductive adhesive bonding combined with gold studs. We demonstrate the stacking technologies on passive test chips rather than real devices and report on technological details.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matthias Heschel, J. F. Kuhmann, Siebe Bouwstra, and M. Amskov "Integrated packaging concept for an intelligent transducer", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320187
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KEYWORDS
Transducers

Adhesives

Silicon

Glasses

Gold

Packaging

Photoresist materials

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