Paper
29 June 1998 Negative pattern fabrication using laser exposure of positive photoresist
Boris Kobrin, Colleen Hagen
Author Affiliations +
Abstract
The method of simultaneous positive and negative pattern formation on a single positive photoresist layer is described. A negative photoresist pattern was fabricated by using local laser exposure to crosslink a positive resist layer, consecutive UV flood exposure, and resist developing. The positive pattern is obtained on the same photoresist layer in the areas masked from the UV flood exposure. Effects of laser energy and resist processing parameters on height and width of negative type resist structures were investigated. Metal line grid structures with lines in the region of 3 to 30 micrometers in width were manufactured on a 5' X 5' glass substrate using this technique. The proposed method of positive/negative pattern formation significantly reduces the number of technological steps in the fabrication of diffractive elements for dual-wavelength applications.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Boris Kobrin and Colleen Hagen "Negative pattern fabrication using laser exposure of positive photoresist", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312380
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KEYWORDS
Photoresist materials

Ultraviolet radiation

Floods

Metals

Chemical elements

Glasses

Laser energy

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