Novel negative photoresist based on polar alicyclic polymers for ArF excimer laser lithography

Shigeyuki Iwasa; Kaichiro Nakano; Katsumi Maeda; Etsuo Hasegawa

doi:10.1117/12.312460

29 June 1998 Novel negative photoresist based on polar alicyclic polymers for ArF excimer laser lithography

Shigeyuki Iwasa, Kaichiro Nakano, Katsumi Maeda, Etsuo Hasegawa

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312460
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

A new polar alicyclic polymer has been developed as an ArF negative resist polymer. Poly(carboxytetracyclo[4.4.0.1^2,51^7,10] dodecyl acrylate-hydroxytricyclo[5.2.1.0^2,6]decyl acrylate (polyCTCDDA_m-TCDAOH_n)) has carboxyl and hydroxyl groups. It was founded that reactivity of the hydroxyl group was much higher than that of the carboxyl group in the acid- catalyzed crosslinking reaction. Poly(CTCDDA₃₂-TCDAOH₆₈) exhibits good solubility (0.5 micrometers /sec) in the standard developer (2.38% TMAH aq.), high transparency (70%/0.5 micrometers ) at 193-nm and high thermal stability (decomposition point: 230 degree(s)C). A chemically amplified negative resist composed of this polymer and 1,3,4,6- tetrakis(methoxymethyl)glicoluril (TMGU) provided a resolution of 0.18-micrometers L/S pattern with an ArF exposure system (NA equals 0.55) at a 9.2 mJ/cm² dose.

Citation Download Citation

Shigeyuki Iwasa, Kaichiro Nakano, Katsumi Maeda, and Etsuo Hasegawa "Novel negative photoresist based on polar alicyclic polymers for ArF excimer laser lithography", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312460

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