Paper
19 July 1999 Design, figuring, and measurement of a correction plate for a wafer stepper
Denis A.M. Faas, Cees J. Van Der Laan, Joseph J. M. Braat, Tark Wijchers
Author Affiliations +
Proceedings Volume 3749, 18th Congress of the International Commission for Optics; (1999) https://doi.org/10.1117/12.354769
Event: ICO XVIII 18th Congress of the International Commission for Optics, 1999, San Francisco, CA, United States
Abstract
A plate with constant thickness was designed to compensate for the residual distortion in the image projected by a high-quality projection lens for lithography. The two surfaces of the plate have an identical aspheric profile whose shape has been calculated using the measured distortion map of the lithographic objective. The figuring process applied to the plate uses the principle of polishing in the presence of an elastical deformation to achieve the desired aspheric shape on both sides. A description is given of the subsequent process steps and of the obtained surface accuracy.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Denis A.M. Faas, Cees J. Van Der Laan, Joseph J. M. Braat, and Tark Wijchers "Design, figuring, and measurement of a correction plate for a wafer stepper", Proc. SPIE 3749, 18th Congress of the International Commission for Optics, (19 July 1999); https://doi.org/10.1117/12.354769
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KEYWORDS
Aspheric lenses

Distortion

Semiconducting wafers

Lithography

Surface finishing

Manufacturing

Objectives

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