Glass, plastic, and semiconductors: packaging techniques for miniature optoelectronic components

Michael D. Pocha; Henry E. Garrett; Rajesh R. Patel; Leslie M. Jones III; Michael C. Larson; Mark A. Emanuel; Steven W. Bond; Robert J. Deri; R. F. Drayton; Holly E. Petersen; Mark E. Lowry

doi:10.1117/12.379570

15 March 2000 Glass, plastic, and semiconductors: packaging techniques for miniature optoelectronic components

Michael D. Pocha, Henry E. Garrett, Rajesh R. Patel, Leslie M. Jones III, Michael C. Larson, Mark A. Emanuel, Steven W. Bond, Robert J. Deri, R. F. Drayton, Holly E. Petersen, Mark E. Lowry

Author Affiliations +

Proceedings Volume 3912, Micro- and Nanotechnology for Biomedical and Environmental Applications; (2000) https://doi.org/10.1117/12.379570
Event: BiOS 2000 The International Symposium on Biomedical Optics, 2000, San Jose, CA, United States

Abstract

At Lawrence Livermore National Laboratory, we have extensive experience with the design and development of miniature photonic systems which require novel packaging schemes. Over the years we have developed silicon micro-optical benches to serve as a stable platform for precision mounting of optical and electronic components. We have developed glass ball lenses that can be fabricated in-situ on the microbench substrate. We have modified commercially available molded plastic fiber ribbon connectors (MT) and added thin film multilayer semiconductor coatings to create potentially low-cost wavelength combiners and wavelength selective filters. We have fabricated both vertical-cavity and in-plane semiconductor lasers and amplifiers, and have packaged these and other components into several miniature photonics systems. For example, we have combined the silicon optical bench with standard electronic packaging techniques and our custom-made wavelength-selective filters to develop a four-wavelength wavelength-division-multiplexing transmitter module mounted in a standard 120-pin ceramic PGA package that couples light from several vertical-cavity-surface-emitting-laser arrays into one multimode fiber-ribbon array. The coupling loss can be as low as 2 dB, and the transmitters can be operated at over 1.25 GHz. While these systems were not designed for biomedical or environmental applications, the concepts and techniques are general and widely applicable.

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Michael D. Pocha, Henry E. Garrett, Rajesh R. Patel, Leslie M. Jones III, Michael C. Larson, Mark A. Emanuel, Steven W. Bond, Robert J. Deri, R. F. Drayton, Holly E. Petersen, and Mark E. Lowry "Glass, plastic, and semiconductors: packaging techniques for miniature optoelectronic components", Proc. SPIE 3912, Micro- and Nanotechnology for Biomedical and Environmental Applications, (15 March 2000); https://doi.org/10.1117/12.379570

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KEYWORDS

Silicon

Optical filters

Packaging

Glasses

Lenses

Tolerancing

Wavelength division multiplexing

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