Paper
19 July 2000 Proximity effect correction for reticle fabrication
Masao Sugiyama, Shinji Kubo, Koji Hiruta, Takayuki Iwamatsu, Tatsuya Fujisawa, Hiroaki Morimoto
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Abstract
As the LSI pattern density increases, the minimum feature size on reticle decreases and the required dimensional accuracy becomes more severe. To write patterns for 130nm- node device, the proximity effect correction is essential for electron beam mask writing system to obtain enough CD accuracy. We optimized the proximity effect correction parameters in EB mask writer, and the evaluated results are presented.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masao Sugiyama, Shinji Kubo, Koji Hiruta, Takayuki Iwamatsu, Tatsuya Fujisawa, and Hiroaki Morimoto "Proximity effect correction for reticle fabrication", Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); https://doi.org/10.1117/12.392056
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Cited by 1 scholarly publication.
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KEYWORDS
Reticles

Photomasks

Electron beams

Beam shaping

Dry etching

Etching

Backscatter

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