15 August 2000Nano-spring arrays for high-density interconnect
David K. Fork, Christopher L. Chua, Patrick Kim, Linda T. Romano, Rachel Lau, Lai Wong, Andrew Alimonda, Vicki Geluz, Mark Teepe, Joe Haemer, Mitul B. Modi, Qi Zhu, Dennis L. Ma, Suresh Sitaraman, Donald L. Smith, Sammy Mok
David K. Fork,1 Christopher L. Chua,1 Patrick Kim,1 Linda T. Romano,1 Rachel Lau,1 Lai Wong,1 Andrew Alimonda,1 Vicki Geluz,1 Mark Teepe,1 Joe Haemer,2 Mitul B. Modi,2 Qi Zhu,2 Dennis L. Ma,2 Suresh Sitaraman,2 Donald L. Smith,3 Sammy Mok3
1Xerox Palo Alto Research Ctr. (United States) 2Georgia Institute of Technology (United States) 3NanoNexus Inc. (United States)
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A new type of compliant interconnect derived from a thin metal film fabricated with a controlled stress profile is being developed for flip- flop interconnects and probing devices. Interconnections have been demonstrated on lateral pitches as tight as 6 microns. The interconnect is highly elastic and can provide up to hundreds of microns of vertical compliance.
David K. Fork,Christopher L. Chua,Patrick Kim,Linda T. Romano,Rachel Lau,Lai Wong,Andrew Alimonda,Vicki Geluz,Mark Teepe,Joe Haemer,Mitul B. Modi,Qi Zhu,Dennis L. Ma,Suresh Sitaraman,Donald L. Smith, andSammy Mok
"Nano-spring arrays for high-density interconnect", Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); https://doi.org/10.1117/12.395634
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David K. Fork, Christopher L. Chua, Patrick Kim, Linda T. Romano, Rachel Lau, Lai Wong, Andrew Alimonda, Vicki Geluz, Mark Teepe, Joe Haemer, Mitul B. Modi, Qi Zhu, Dennis L. Ma, Suresh Sitaraman, Donald L. Smith, Sammy Mok, "Nano-spring arrays for high-density interconnect," Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); https://doi.org/10.1117/12.395634