Electrical reliability of conductive adhesive joints: curing conditions and current density dependence

Hyungkun Kim; Hong Zhou; S. Chungpaiboonpatana; Frank G. Shi; S. Machuga; J. Adam

doi:10.1117/12.410079

23 August 2000 Electrical reliability of conductive adhesive joints: curing conditions and current density dependence

Hyungkun Kim, Hong Zhou, S. Chungpaiboonpatana, Frank G. Shi, S. Machuga, J. Adam

Proceedings Volume 4182, Process Control and Diagnostics; (2000) https://doi.org/10.1117/12.410079
Event: Microelectronic Manufacturing, 2000, Santa Clara, CA, United States

Abstract

Electronic packaging is increasingly becoming a vital part of the electronics industry, representing a key barrier to cost reduction and performance improvement. Flip-chip joining using conductive polymeric adhesives have been identified as a key technologies for future electronics assembly and manufacturing. The purpose of this study is to investigate optimum conditions to achieve the best electrical performance in conductive adhesive joints. Therefore, the quality and reliability tested in conductive adhesive joints were performed at various current densities with different curing conditions. Differential scanning calorimetry and resistance measurement were used to monitor curing condition in conductive adhesives. Accelerated life testing of conductive adhesive joints made of the selected conductive adhesive using different curing conditions was performed with various current densities. The current-induced degradation of conductive adhesive joints was investigated through optical microscope and resistance measurements. Results show a shift in contact resistance depending on curing condition and current density. The contact resistance shift is found to be due to the migration of conducting particles in the adhesive joint.

Citation Download Citation

Hyungkun Kim, Hong Zhou, S. Chungpaiboonpatana, Frank G. Shi, S. Machuga, and J. Adam "Electrical reliability of conductive adhesive joints: curing conditions and current density dependence", Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); https://doi.org/10.1117/12.410079

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KEYWORDS

Resistance

Adhesives

Particles

Reliability

Copper

Silver

Glasses

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