Test and reliability analysis of PBGA assemblies under random vibration

Qingjin Yang; Zhiping Wang; Geok Hian Lim; Hock Lye John Pang; Fook Fah Yap; Rongming Lin

doi:10.1117/12.404868

23 October 2000 Test and reliability analysis of PBGA assemblies under random vibration

Qingjin Yang, Zhiping Wang, Geok Hian Lim, Hock Lye John Pang, Fook Fah Yap, Rongming Lin

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404868
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

To understand the high-cycle reliability of plastic ball grid array (PBGA) interconnections under external random vibration loading, a series of vibration test of PBGA assemblies were conducted. The test vehicle has four PBGA modules assembled on a printed circuit board. The assembly was clamped at two opposite sides on a fixture, which was bolted to a vibration excitation. Firstly, the dynamic properties of the assembly under external random vibration excitation were characterized. The resonant frequencies of the assembly were identified, and the maximum dynamic deflection was estimated. Then the reliability test were carried out. In the reliability tests, the electrical resistance of PBGA modules was continuously monitored, so that any failure could be detected. This paper describes the test procedures, and shows the typical vibration fatigue failures in the PBGA interconnections. Test results will be analyzed in detail.

Citation Download Citation

Qingjin Yang, Zhiping Wang, Geok Hian Lim, Hock Lye John Pang, Fook Fah Yap, and Rongming Lin "Test and reliability analysis of PBGA assemblies under random vibration", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404868

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