Plenary Papers (13)
Material Test (20)
Fracture and Fatigue (16)
Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method
Microwave apparatus to study the mechanical behavior of solid samples subjected to external stresses
Ultrasonic characterization of the interface between die attach and copper leadframe in IC packaging
Experimental study on CBGA assembly in various environmental temperatures using moire interferometry